实时全球研报
The path to €58 EPS in ‘30: Why 4F² DRAM Could Be ASM’s Next Major Growth Engine
研报英文原文证据摘录
The path to €58 EPS in ‘30: Why 4F² DRAM Could Be ASM’s Next Major Growth Engine
Investment Thesis: Why ASM Is Entering a
New Growth Phase
We reiterate our Buy rating on ASM and raise our PO to €1,435. We expect ASM to be a
major beneficiary of the adoption of 4F2 in the coming 2-3 years.
4F² – The Most Important DRAM Architecture Transition Since EUV
We believe the transition from conventional 6F² DRAM to 4F² architectures represents
the most important memory equipment inflection since the introduction of EUV in
DRAM. While DRAM scaling over the past decade has primarily been achieved through
lithography advances and increasingly complex patterning, the industry is now
approaching both physical and economic limits. As feature sizes move below 10nm-class
nodes, maintaining the traditional 6F² planar cell becomes increasingly challenging due
to capacitor scaling constraints, leakage, process variability and escalating
manufacturing costs. As a result, memory manufacturers are pursuing a fundamentally
different architecture based on 4F² cell layouts, vertical channel transistors (VCTs),
periphery-under-cell (PUC) integration and ultimately 3D DRAM structures. Industry
reports suggest Samsung is targeting initial 4F² production around 2028, with SK hynix
following a similar path, while Micron is expected to move towards a vertical DRAM
architecture thereafter.
Why 4F² Drives a Step-Change in ALD and Epitaxy Demand
From ASM's perspective, the critical point is that 4F² is not simply another DRAM node
shrink. The transition requires a much higher degree of materials engineering and three-
dimensional device construction. Vertical channel transistors introduce extremely high
aspect-ratio structures requiring highly conformal depositions. New channel materials,
本摘录由系统从所标注的 PDF 证据页直接提取并保留英文原文,不做批量翻译;登录后在阅读器切换中文时才按需翻译。
打开研报阅读器