HBM-GPU Disaggregation?, Intel Client CPU Roadmap, & More—Headline Review (Semis & IT Hardware)

Research evidence excerpt

HBM-GPU Disaggregation?, Intel Client CPU Roadmap, & More—Headline Review (Semis & IT Hardware)

hitecture later this

year.

• Huawei notes that the architecture emphasizes data movement rather than component shrink

alone; LogicFolding architecture noted to fold and stack logic circuits into a dual layer framework

and dramatically shortening internal wiring to eliminate signal delays.

• Huawei is targeting use of LogicFolding architecutre with Ascent AI chips by 2030 and a transistor

density that is equivalent to 1.4nm-class leading edge chips by 2031.

5. Lightmatter Joints TSMC COUPE for 3D Optical Engines

• DigiTimes (see here) has reported that privately-held Lightmatter is working with TSMC COUPE

(Compact Universal Photonic Engine) platform for next-generation 3D stacked silicon photonics

engine.

• The article notes that Lightmatter is focused on deployment of their Near-Packaged Optics (NPO)

solutions in 2027; Co-Packaged Opticsd (CPO) solutions in 2028 and full interposer technology

looking into 2029.

• Lightmatter introduced their Very Large Scale Photonic (VLSP) laser chip in January 2026;

integrating 128 laser diodes on a single chip. The company has emphasized that its Guide laser

products differ from traditional indium phosphide (InP) lasers as it is not manufactured using

conventional InP wafer fabs. The Guide laser combine InP with 300mm complementary metal-

oxide-semiconductor (CMOS) manufacturing - reducing InP material demand and improving

output scaling.

• The Guide solutions integrate into a Laser Network Interface Card (LNIC) form factor for high-

density laser light sources; integrated with liquid cooling architectures. This is also noted as

differentiated versus traditional external laser small form factor pluggable (ELSFP), which provides