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普通外文研报

中小型株/製造業: 半導体製造装置及び関連銘柄の2026年初夏の投資戦略

发布日期: 2026-06-11研究机构: Morgan Stanley报告页数: 40原文语言: 日语证据页码: 19

研报英文原文证据摘录

中小型株/製造業: 半導体製造装置及び関連銘柄の2026年初夏の投資戦略

35,450 32,877 32,462 37,105 36,845 34,816 33,209 29,553 29,176

Short-term borrowings, bonds 短期借入金・社債 29,922 47,996 65,000 59,000 43,000 20,372 16,563 25,753 35,313 35,550 35,298 28,461 29,922 34,021 33,281 41,902 47,996

Other current liabilities その他流動負債 20,124 24,656 28,458 32,108 34,998 11,828 12,619 12,369 15,875 11,744 14,222 15,773 20,124 16,754 17,278 18,000 24,656

Fixed liabilities 固定負債 50,057 47,599 48,042 48,380 48,015 25,424 36,365 37,868 41,965 41,180 45,735 50,250 50,057 48,983 52,054 48,411 47,599

Long-term borrowings, bonds 長期借入金等 38,668 36,652 35,652 34,652 33,652 19,802 30,460 30,260 30,850 30,373 34,907 39,132 38,668 37,859 40,887 37,117 36,652

Other fixed liabilities その他固定負債 11,389 10,947 12,390 13,728 14,363 5,622 5,905 7,608 11,115 10,807 10,828 11,118 11,389 11,124 11,167 11,294 10,947

Total liabilities 負債合計 136,949 149,428 176,221 180,338 171,041 90,430 94,939 109,511 128,604 121,351 127,718 131,589 136,949 134,574 135,822 137,866 149,428

Equity/net assets 資本/純資産 138,372 154,031 166,482 181,752 199,114 114,870 118,889 122,990 134,137 135,496 135,777 140,019 138,372 139,092 144,492 150,331 154,031

Total liabilities + equity 負債・純資産合計 290,234 320,175 342,703 362,090 370,155 211,341 219,913 246,342 277,200 271,386 277,916 286,388 290,234 288,902 295,816 304,248 320,175

Shareholders' equity ratio 株主資本比率 47.7% 48.1% 48.6% 50.2% 53.8% 54.4% 54.1% 49.9% 48.4% 49.9% 48.9% 48.9% 47.7% 48.1% 48.8% 49.4% 48.1%

Cash & equivalents 現金同等物 30,354 34,160 34,863 37,783 33,841 15,926 14,056 18,278 23,327 21,920 27,946 28,116 30,354 28,901 30,275 31,626 34,160

Debt outstanding 借入金残高 68,590 84,648 100,652 93,652 76,652 40,174 47,023 56,013 66,163 65,923 70,205 67,593 68,590 71,880 74,168 79,019 84,648

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