Semiconductor Explosive Update: HBM4 Doubles + Rubin Delayed + 谷歌 TPU Surges

English summary

### Semiconductor Explosive Update: HBM4 Doubles + Rubin Delayed + 谷歌 TPU Surges Time: 2026-07-29 19:34:22 Content: Let's get straight to the key points. Recent semiconductor information density is exploding. Looking at several clues together, the 2027 industry landscape will be much more intense than imagined. Based on public industry research information, it does not constitute investment advice. Clue 1: CoWoS capacity 180,000 wafers/month, 英伟达 takes more than half. By the end of 2027, 台积电's CoWoS capacity is expected to be 180,000 wafers/month. 英伟达 accounts for more than half, about 103,000 wafers/month, possibly reaching 629,000 wafers/month by 2029. Other players share the rest: AMD: overall packaging allocation capacity increased to 300,000 wafers/month, but the increase mostly comes from 日月光; 联发科: expected to receive more quota in 2027, custom ASIC share may increase; 日月光: FoCoS capacity raised to 50,000 wafers/month, serving CPUs and network chips; 博通: second largest customer, relatively stable share; 台积电 also allocated additional capacity to 思灵科技's Vera series CPUs. ...