Glass Substrates Encounter Intensive Catalysts Again, Firmly Bullish on Glass Substrate Industry Trend [国金AI新材料&建材李阳团队]

English summary

#Glass Substrates Encounter Intensive Catalysts Again, Firmly Bullish on Glass Substrate Industry Trend [国金AI新材料&建材李阳团队] 1. 蓝思科技 & Intel Signed Cooperation Memorandum On July 24, 蓝思科技 officially announced the signing of a cooperation memorandum with Intel. Both parties will take TGV advanced packaging as the core R&D direction. Intel provides key technical support such as semiconductor architecture solutions, DFM design specifications, and standardized verification systems; both parties will jointly tackle core processes such as glass substrate forming, laser micro-hole processing, through-hole metallization, and multi-layer wiring, advancing technology iteration, engineering verification, and commercialization. 蓝思 has deep technical accumulation in glass deep processing (cutting, chamfering, drilling, copper plating, etc.) and has abundant overseas customer resources. 2. #Continuously Witnessing Industry Acceleration, Equipment Makers Densely Upgrade Shipment Expectations 1) On 7/23, LPKF（德国乐普科）released its semi-annual report, upgrading its downstream corresponding market space from 500 million euros in 2030 to 1.7 billion euros. 2) 台湾钛昇 mentioned at its investor conference that trial production is accelerating, originally expected in 2028, now advanced to 27H2. ...