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Broadcom Inc: Samsung Multi-Year Memory/Foundry MOU Implies > $1 Trillion of Cumulative Broadcom AI Revenues Over the Next 5 Years in Our View; Reiterate OW
研报英文原文证据摘录
Broadcom Inc: Samsung Multi-Year Memory/Foundry MOU Implies > $1 Trillion of Cumulative Broadcom AI Revenues Over the Next 5 Years in Our View; Reiterate OW
J P M O R G A N North America Equity Research
27 July 2026
Broadcom Inc
Samsung Multi-Year Memory/Foundry MOU Implies > Overweight
$1 Trillion of Cumulative Broadcom AI Revenues Over AVGO, AVGO US
the Next 5 Years in Our View; Reiterate OW Price (24 Jul 26):$381.92
Price Target (Dec-26):$580.00
On Saturday, Samsung (covered by Jay Kwon) announced it had signed a Semiconductors & Semiconductor
memorandum of understanding (MOU) with Broadcom to expand their strategic Capital Equipment / IT Hardware
collaboration across memory and advanced foundry technologies, supporting the Harlan Sur AC
next generation of AI infrastructure (see PR here). We believe that Samsung is and (1-415) 315-6700
will continue to remain Broadcom’s main supplier of high bandwidth memory harlan.sur@jpmorgan.com
(HBM DRAM), and we estimate that around 75-85% of all of Broadcom’s HBM Apoorva Kumar
DRAM requirements going forward will be supplied by Samsung. The companies (1-212) 270-0668
expect the collaboration to result in MORE than $200B of Samsung memory/ apoorva.kumar@jpmorgan.com
foundry products (we estimate Broadcom’s Samsung purchase mix as 90-95% Mayur Ramdhani
(1-212) 622-1664
HBM, 5-10% foundry wafers) over the next 5 years through 2030, and based on mayur.ramdhani@jpmorgan.com
our calculations, we estimate that this implies > $1T of cumulative Broadcom AI J.P. Morgan Securities LLC
revenues (ASICs + Networking) and around $40-50B of cumulative Samsung
foundry-based chip sales (we believe that Broadcom will utilize Samsung for
datacenter networking, broadband, and telco service provider chips). Our estimate
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