普通外文研报
Initiate at Outperform: WFE and Chemistries for the AI Chip & Package Build-Out
研报英文原文证据摘录
Initiate at Outperform: WFE and Chemistries for the AI Chip & Package Build-Out
June 30, 2026 | 05:55 ET~
MKS Inc.
MKSI-NSDQ Rating Price: Jun-29 Target Total Rtn US Chemicals
Outperform $416.00 $453.00 9%
Bhavesh Lodaya Analyst
bhavesh.lodaya@bmo.com (347) 274-1393
John P. McNulty, CFA Analyst
Initiate at Outperform: WFE and Chemistries for the john.mcnulty@bmo.com (646) 946-8428
Caleb Boehnlein Senior AssociateAI Chip & Package Build-Out
caleb.boehnlein@bmo.com (347) 906-1860
Bottom Line: Margarita Margulis Associate
We are initiating coverage on MKSI with an Outperform rating and a $453 target margarita.margulis@bmo.com (332) 257-0592
price. MKS offers one of the broadest critical-subsystem franchises in semiconductor Legal Entity: BMO Capital Markets Corp.
WFE, alongside exposure to advanced PCB and packaging process steps through its
2YR Price Volume Chart
equipment and chemistry portfolio. We view MKS as a levered beneficiary of the dual 450
AI/data center build-out drivers—expanding semiconductor capacity supporting tool 400350
demand, and rising materials intensity at the leading edge and in advanced packaging. 300
With cycle duration extending, we see attractive upside and compelling risk/reward 250 76
200 5
over the medium-term. 150 43
100 2
Key Points 50 Dec Jun Dec Jun 0
LHS: Price ($) / RHS: Volume (mm) Source: FactSet
Exposure to Industry Investments: MKS is the only company selling content in Company Data in $
both of AI's primary hardware build-outs simultaneously: semiconductor wafer
Dividend $1.00 Shares O/S (mm) 67.5
fabrication, where it addresses more than 85% of WFE (wafer fabrication equipment)
applications across the big-five OEMs, and advanced PCB (printed circuit board) and Yield 0.2% Market Cap (mm) $28,097
本摘录由系统从所标注的 PDF 证据页直接提取并保留英文原文,不做批量翻译;登录后在阅读器切换中文时才按需翻译。
打开研报阅读器