2026 semiconductor industry - Key takeaways from TSMC 2026 Technology Symposium

研报英文原文证据摘录

2026 semiconductor industry - Key takeaways from TSMC 2026 Technology Symposium

Taiwan Equity | Technology

Event Analysis

Fubon Research 2026 semiconductor industry

May 15, 2026

Key takeaways from TSMC 2026 Technology Symposium

1. AI/HPC to drive semiconductor market toward US$1.5tn as TSMC unveils advanced

process roadmap

2. Simultaneous CoWoS, SoIC upgrades; advanced packaging to become key bottleneck,

growth driver for AI computing power expansion

3. COUPE to become next big thing

AI/HPC to drive semiconductor market toward US$1.5tn as TSMC unveils advanced

TSMC held its 2026 Technology Forum in Taiwan on May 14. The company estimates that

Source: google

the global semiconductor market will exceed US$1tn in 2026 and further reach US$1.5tn by

2030, with the main growth momentum coming from HPC and AI applications. By

application, HPC and AI account for 55% of the total market, smartphones 20%, and

automotive and IoT each 10%. In terms of advanced processes, TSMC expects N3

technology to be the main source of sales in FY26, with applications covering smartphones,

auto, data centers, and smart glasses. N2 has officially entered mass production, with more

than 25 design wins for 2nm and over 70 customer designs in progress; the first-year

wafer output is expected to be 45% higher than N3. In addition, N2/A16 capacity will

enter a rapid expansion phase from FY26 to FY28, with an expected annual compound

growth rate of 70%, and the yield learning curve is better than N3. N3 and N5 capacity

will expand at 25% CAGR from FY22 to FY27 to support customers’ ongoing business

growth. For the process roadmap, TSMC will mass-produce the N2P process node in 2H26,

Daniel Yang

launch the N2X and A16 platforms in FY27, introduce A14 and the multifunctional N2U(886-2) 2781-5995 ext.