Semiconductor Back-end Process and Package Trends

Research evidence excerpt

Semiconductor Back-end Process and Package Trends

Japan | Technology EquityJulyResearch21, 2026

Semiconductor Back-end Process and

Package Trends

We held a seminar on the topic with Professor Fumihiro Inoue from

Yokohama National University. He is the top Japanese researcher in the

field of advanced packages. AI application has significantly expanded the

market for advanced packages. Professor Inoue believes that optimization

of the overall system will be important for package technology as well.

Below we summarize the content of his presentation.

Fumihiro Inoue:

Professor, Yokohama National University•

Semiconductor and Quantum Integrated Electronics Research Center, Deputy Center•

Head and Professor

Cross-Appointment Professor, Hokkaido University•

LSTC, 3D Packages Deputy Division Head•

2011-21 imec Researcher•

Main research areas: Semiconductor back-end process, chiplets, 3D integration, process•

development

AI system configuration: In contrast to traditional CPU-centric configurations in PCs,

smartphones, and other devices, AI systems utilize a configuration with memory (DRAM,

SSD, and HBM) that conduct high-speed data interaction with CPU and GPU devices. CPU

importance is growing again amid future expansion of the edge AI market, in addition to

cloud AI. Chiplets, which integrate multiple chips, are essential systems for the realization

of AI systems due to the increasing difficulty of delivering cost and power consumption

improvements for monolithic devices via finer processes. Chiplets connect individual devices

manufactured at high productivity using optimal technology nodes and facilitate advantages

in power consumption and costs and optimal interconnection designs. Back-end processes

are not just simple assembly steps and actually generate added value.