GLOBAL RESEARCH ARCHIVE
Jentech Precision Industrial Co Ltd (3653 TT, NT$3,390) - Leader in heat spreader, big gets bigger
Research evidence excerpt
Jentech Precision Industrial Co Ltd (3653 TT, NT$3,390) - Leader in heat spreader, big gets bigger
Taiwan Equity | Technology
Company In-depth
Company overview
No. 1 global market share in heat spreaders
Jentech’s core products include heat spreaders, lead frames, and electronic peripheral
components, and it is the global market share leader in high-end computing heat
spreaders. In FY25, Jentech’s product mix was: lead frames 9%, thermal products
(including heat spreaders and thermal modules) 73%, electronic components 7%, and
others 11%. Its thermal products are widely applied to servers, autos, PCs, gaming
consoles, and consumer electronics. In recent years, the product line has extended to the
development of high-speed computing, AI, and auto applications. To meet server demand
for comprehensive thermal solutions and strengthen vertical integration in manufacturing,
Jentech leverages heat spreader (packaging) technology as its foundation, expanding
upward into air and liquid cooling modules (system) and downward into CPU socket
retention products (component), thereby building a complete product ecosystem.
Figure 1: Jentech’s thermal solution product development path
Source: Company
(1) Thermal products:
Jentech’s thermal product business includes integrated heat spreaders (IHS), stiffeners,
and thermal modules. Among these, heat spreaders and stiffeners are part of the
semiconductor back-end packaging process. The heat spreader is a metal lid covering the
top of the chip, providing protection, chip support, and uniform heat conduction and
dissipation. Stiffeners are mostly designed as metal frames or rings surrounding the chip
to maintain structural stability. Jentech’s heat spreaders and stiffeners are used in Intel,
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