Daily Views on Tech Headlines | GOOGL, Samsung, TSMC, NVDA, AMD, China, and Amphenol

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Daily Views on Tech Headlines | GOOGL, Samsung, TSMC, NVDA, AMD, China, and Amphenol

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June 12, 2026 Hardware

Daily Views on Tech Headlines | GOOGL, Samsung, TSMC,

Analysts NVDA, AMD, China, and Amphenol

Matt Bryson

(617) 695-6302

matthew.bryson@wedbush.com

Antoine Legault, CFA, CPA GOOGL, Samsung, TSMC: Samsung reportedly in talks for GOOGL 2nm TPU order

(626) 497-1619

antoine.legault@wedbush.com View: GOOGL is reportedly considering Samsung for part of the production of its

next-generation AI processor. Per The Information, for 10G TPUs, TSMC would

produce the main compute die on its 1.4nm node, while Samsung would fabricate

the 2nm memory I/O die, the component that links the processor to HBM. This

news follows speculation that Google might shift fabrication or advanced packaging

on Mediatek based TPU dies to Intel.

We see this newsflow as predominantly highlighting how tight TSMC capacity

remains, as we believe both the use of alternative fabs and the splitting of process

flow as create incremental complexity that likely has some negative connotations

for yield, and therefore ultimately costs (even if TSMC alternatives are cheaper).

While we believe Samsung's positioning in foundry has improved, we'd also note

that many of its recent wins appear lower quality in nature: Tesla, we believe, was

given special treatment and pricing. The Information

NVDA, INTC, AMD, TSMC (Datacenter CPU): NVIDIA opens Vera CPU sales to China

View: Per Reuters, NVIDIA has told Chinese customers its Arm-based Vera CPUs

could ship as soon as August with NVDA now taking orders for the parts. One cloud

provider is reportedly planning 300+ dual Vera servers. NVDA flagged ~$20B of CPU

revenue visibility this year and ~4M Vera CPUs in FY27 per Tom's Hardware, against