First Read: Asia Semiconductor Insight "2026 COMPUTEX booth tour takeaways" Lin

Research evidence excerpt

First Read: Asia Semiconductor Insight "2026 COMPUTEX booth tour takeaways" Lin

Global Research

4 June 2026ab

First Read

EquitiesAsia Semiconductor Insight

2026 COMPUTEX booth tour takeaways Asia

Semiconductors

Sunny Lin

MediaTek: new technology development across auto, CPO, and PC Analyst

The company showcased its latest developments within auto, co-packaged optics (CPO), sunny.lin@ubs.com

PC, and flagship smartphone SoC. For auto: The 3nm Dimensity C-X1 flagship auto +886-2-8722 7346

cockpit SoC partnered with TSMC and Nvidia is set to be adopted by a key Chinese Ryan Sun

customer in H226, with more customers expected in 2027. MediaTek is also engaging Associate Analyst

with customers in US, Europe, Japan, and Korea. The ASP for its automotive Dimensity ryan-za.sun@ubs.com

series should be substantially higher than flagship mobile SoCs (at US$200 range). +886-2-8722 7267

MediaTek's collaboration with Denso on ADAS may contribute to sales from 2029. For

CPO: MediaTek demonstrated its own optical engine technology, which it could offer for

Cloud ASICs on top of the solution collaborated with Ayar Labs. We believe Cloud ASIC

accelerators could adopt CPO for scale up from 2029. MediaTek also showcased the

MicroLED based optics prototype for servers, collaborated with Microsoft. It is designed

for connections outside the rack with distances up to 30-50m, integrated with a light

digital signal processor (DSP). For PC: The new Nvidia RTX Spark took center stage, with

capabilities to support local models of up to 120bn parameters based on its up to 128G

of unified memory. There are currently 6 OEMs developing relevant devices and the end

products should be available in Q326.

Aspeed: expanding server board content with new products