Technology - Taiwan: CPO Tech Forum by WinWay – strength and offerings well-discussed

Research evidence excerpt

Technology - Taiwan: CPO Tech Forum by WinWay – strength and offerings well-discussed

Accessible version

Technology - Taiwan

CPO Tech Forum by WinWay – strength and

offerings well-discussed

Industry Overview

Growing traction by CPO against copper-based solutions 14 May 2026

We attended the CPO (co-packaged optics) Technology Forum hosted by WinWay Equity

Technology, and came away with positive takeaways on the company and related Taiwan

industry trends. According to WinWay, optical-based solutions are expected to be Technology

increasingly adopted given the challenge seen from different aspects, including Mike Yang >>

mechanical structure (package size), electrical performance based on 224Gbps PAM4 Research Analyst

(pulse amplitude modulation 4-level) data-transmission/thermal density (power Merrill+886 2Lynch2376 (Taiwan)3729

consumption). On power consumption, WinWay stated the device with 8kw+ may be mike.c.yang@bofa.com

seen in 2027. Also, the pin count in testing socket may increase from 10k+ to 50k in the Haas Liu >>

Research Analyst

coming years. Merrill Lynch (Taiwan)

+886 2 2376 3727

Multiple offerings by WinWay at different stages haas.liu@bofa.com

Cathy Hsu >>

According to WinWay, it can offer 1) probe head/card for conducting the EIC/PIC Research Analyst

(electronic/photonic integrated circuit) wafer/die-level testing; 2) testing socket for OE Merrill Lynch (Taiwan)

+886 2 2376 3726

(optical engine) after combining EIC/PIC and double-sided probing system at package- cathy.hsu3@bofa.com

level; and 3) HyperSocket solution for module-level testing.

Advantages by HyperSocket; positive for substrate names

Specifically on HyperSocket, WinWay combines the elastomer with pogo pin (spring