[DW Electronics] Daily Viewpoint Report

English summary

#Opinion: # Xinqi Micro (芯碁微装) has a five-fold upside in three years: Advanced packaging continues to boom, with technology iterating along the CoWoS-S→CoWoS-L→CoPoS route. Many domestic manufacturers are undergoing large-scale capacity expansion for 2.5D/3D advanced production lines. Currently, the industry faces tight high-end packaging and testing capacity, with full-chain price increases across upstream and downstream. Meanwhile, fab plants are accelerating cross-border layout in advanced packaging, coupled with urgent demand for domestic substitution of storage and computing chips. Pay attention to Xinqi Micro, a golden shovel stock in advanced packaging! The company's overseas layout continues to exceed expectations, and we firmly see five-fold space in the next three years! Joulwatt (杰华特): Fully embrace the analog chip track! From capacity, products, and market share, Joulwatt is definitely the most elastic target in this round of analog chips. ...