TCL Technology Completes Issuance of RMB 2 Billion Tech Innovation Corporate Bond

English summary

TCL Technology announced completion of the second phase of its 2026 publicly issued tech innovation corporate bonds (digital economy) to professional investors, with a total size of RMB 2 billion. The 3-year tranche was RMB 1 billion at a coupon of 1.85%, and the 5-year tranche was RMB 1 billion at 2.1%. Underwriters and affiliates subscribed RMB 930 million; directors and senior executives did not participate.