TODAY'S MARKET INTELLIGENCE
TCL Technology completes issuance of RMB 2 billion sci-tech innovation bonds
English summary
TCL Technology announced the completion of its RMB 2 billion issuance of sci-tech innovation corporate bonds (digital economy) (tranche 2), with RMB 1 billion 3-year notes at 1.85% and RMB 1 billion 5-year notes at 2.1%. Lead underwriters and affiliates took RMB 930 million, while related parties did not subscribe.
The English text is machine translated and may require verification against the Chinese version.
Browse today's intelligence